bonder的中文翻译

bonder

英[ˈbɒndə(r)] 美[bɑːndər]

n. 连接器；顶砖
n. （Bonder）人名；（英）邦德；（罗）邦德尔

双语例句

1. In this paper, an automatic wire bonder is presented.: 本文介绍了一台自动引线键合装置。

2. Its accuracy will influence the accuracy of LED die bonder.: 其精度直接影响到LED粘片的精度。

3. The key parts of thick-film LED bonder system are control system and visual position system.: 粘片机系统中的主要部分是控制系统和视觉定位系统。

4. Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.: 基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。

5. Finally, the slave bonder attaches the connecting bonds based on the computed correct bond locations.: 最后从属焊接机基于正确的焊接位置附上连接粘合剂。

6. Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.: 机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。

7. At the same time, the hardware system and software system of automatic bonder are specifically designed.: 同时具体设计了自动焊机的硬件系统和软件系统。

8. Used functional magnetic pulse therapy treatment, and treatment with Bonder Line there is a clear distinction.: 采用磁疗脉冲治疗功能治疗时，与带线粘片治疗有著明显的区别。

9. At present, the algorithm has been applied to the image matching system of the fully automatic gold wire bonder.: 目前，该算法已在全自动金丝球焊机的图像识别系统中得到实际应用。

10. The sheet is then passed through a thermal bonder (290) to thermally bond the reinforcement glass fibers and resin.: 然后使片材通过热粘合机(290)，以便热粘合增强玻璃纤维和树脂纤维。

11. IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.: 集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。

12. Some good suggestion and opinions to the domestic bonder permanent magnetic industry were brought forward in this paper.: 并对目前国内粘结永磁体现状及方向提出了一些看法和建议。

13. The auto Die Bonder for SOT - 23 transistor is a high - speed, high - precision, machinery electronics integrated equipment.: 23晶体管封装自动键合机是高速、高精度机电一体化精密设备。

14. Bonder is a professional supplier of electronic auxiliary together with experience consultation for the electronic industry.: 力邦泰科技有限公司是一家专业的电子胶水辅料供应商，并提供专业技术顾问服务。

15. The image recognition system is the key component of realizing the automation of LED die bonder as well as its difficult part.: 图像识别系统是实现LED粘片自动化的关键部分，也是其难点。

16. This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.: 本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理，并给出了主要设计参数和计算公式。

17. It is the first time to use the coordinate rotation computer in the automatic wire bonder for the integrated circuit production.: 把座标旋转计算机用于集成电路生产中的自动键合上是首次。

18. A new method for preparing optical thin slice of coal maceral bonder made of epoxy resin E-44 and its application are introduced.: 介绍了一种以环氧树脂e - 44为原料制备煤岩光片黏结剂的新方法及应用。

19. N ew Bonder is a professional supplier of electronic auxiliary together with experience consultation for the electronic industry.: 力邦泰科技有限公司是一家专业的电子胶水辅料供应商，并提供专业技术顾问服务。

20. Increasing the stability of enzyme bonder effectively, decreasing its reactive setting at the same time, improving detecting sensitivity.: 有效地增加了酶结合物的稳定性，同时也降低了反应背景，提高了检测的灵敏度。

21. The internal quality of HTS/977-2 and HTS/MTM44-1 plates with various repair layers cured by hot bonder was analyzed with optical microscope.: 采用光学显微镜观察不同修补层数下的HTS/977-2与HTS/MTM44-1两种预浸料在热补仪固化下的内部质量；

22. The composite product that exits the thermal bonder can be subsequently used as a reinforcement in a molding process to produce composite articles.: 从热粘合机出来的复合材料产品随后可以用作模制工艺中的增强材料而生产复合材料制品。

23. Mainly introduce the function of the eutectic bonder applied to high power die, the technology target, the structure of the machine and the electric control.: 本文主要介绍了大功率管芯共晶设备的主要功能、技术指标、机械结构、电气控制等。

24. A new high energetic bonder intermediate azidodeoxycellulose for solid propellant was synthesized from the raw material cotton linters under homogeneous conditions.: 以棉纤维为原料，在均相反应状态下合成了一种新型推进剂用含能黏合剂—叠氮纤维素。

25. The in-plane and through-thickness direction temperature distribution of composite honeycomb sandwich structure repaired by hot bonder was tested with thermocouples.: 利用热电偶测试热补仪修补复合材料蜂窝夹层结构的面内及厚度方向的温度分布；

26. The results show that the initial temperatures of SD-33 bonder are approximately same, the final (temperatures) increase with the increasing heating rate of TG curves.: 结果表明，在不同升温速率的TG曲线上，SD - 33粘结剂热失重开始温度大致相同，而热失重结束温度随升温速率的增大而升高。

27. Now, Shusen provides the service such as the process of foam sprinkler, colour stripe, super bonder etc, we do our best to provide more products and service for customers.: 现在，树森推出还一系列喷泡、彩带、强力胶的加工服务，努力为新老客户提高更多更完善的产品和服务。

28. The paper makes a manner that use of melt blown nonwoven fabric rim leftover, namely uses as internal material for gauze mask that surface material is spun bonder nonwoven.: 提出熔喷非织造布边料变废为宝的方法，即将其用作面层为薄型纺粘法非织造布的口罩的内层材料。

29. Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.: 超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

30. Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.: 超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

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