tin-plating的中文翻译

tin-plating

英['tin'pleit] 美[tɪn pleɪt]

v. 在……上涂锡

双语例句

1. Tin plating as early as 1843 puts forward the first patent, and after 1930 have industrial practical.: 电镀锡早在1843年就提出了第一个专利，1930年之后才具备工业实用性。

2. For example steel base plated copper, nickel, chromium plating, low layer again tin bronze chrome, multi-layer nickel chrome plating nickel ferroalloy, chrome, and so on.: 例如钢基上镀铜、镍层再镀铬、低锡青铜上镀铬、多层镍上镀铬、镍铁合金镀层上镀铬等等。

3. Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.: 综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。

4. Black tin coating was prepared by multi-arc ion plating technology and wear resistance corrosion resistance heat-proof property and absorption property of solar spectrum were also discussed.: 摘要介绍了利用多弧离子镀工艺制备黑色氮钛膜，并对其耐磨损、耐腐蚀、热稳定性及太阳光谱吸收等性能进行了研究。

5. Author made selection and experiment for brighteners and stabilizers which are used for acidic bright tin plating. More ideal brightener and stabilizer are obtained through the experiments.: 作者对酸性光亮镀锡的光亮剂及稳定剂进行了选择，并作了试验，获得了较为理想的光亮剂和稳定剂。

6. Before or tin plating nickel plating of bad contacts between the cathode, discharge sparks will melt into hollow copper hole.: 镀镍前或锡电镀间的阴极接触不良，放电火花将铜材熔成凹洞。

7. Zinc coating was prepared using mechanical plating technology for the deposition of small amount tin salt.: 采用少锡盐沉积机械镀锌工艺制备了机械镀锌的镀层。

8. A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.: 采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。

9. In order to further improve the properties of tin electrodeposits, a multifunctional sulfate tin plating additive was developed.: 为进一步提高镀锡层的性能，研制出一种多功能硫酸盐镀锡添加剂。

10. The mechanism of electroless plating tin was investigated from displacement process and reduction process.: 对化学镀锡的机理从置换过程和还原过程两个方面进行研究。

11. Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.: 综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。

12. Black tin coating was prepared by multi arc ion plating technology, and wear resistance, corrosion resistance, heat proof property and absorption property of solar spectrum were also discussed.: 介绍了利用多弧离子镀工艺制备黑色氮钛膜，并对其耐磨损、耐腐蚀、热稳定性及太阳光谱吸收等性能进行了研究。

13. Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.: 硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。

14. A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.: 采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。

15. The process formula and flow of BH-411 bright sulfate tin plating, maintenance and management of the bath were introduced.: 介绍了BH-411光亮硫酸镀锡的工艺配方、工艺流程和镀液的维护与管理，讨论了镀液中的硫酸、硫酸亚锡和添加剂的作用。

16. The process of electroless tin plating has wide applications in microelectronic filed.: 化学镀锡工艺在微电子行业具有很好的应用前景。

17. The invention comprises the following procedures: preplating, etching, chromium plating, washing, removal of hydrogen, hole loosing, washing and drying and tin plating treatment.: 本发明包括镀前工序、刻蚀工序、镀铬工序、水洗工序、除氢工序、松孔工序、水洗烘干工序、镀锡处理工序。

18. PLATIVE ISP3023, a kind of insulated protective paint, is specialized applied to general plating treatment, or acid pickling, such as nickel plating, copper plating, chrome plating, tin plating, etc.: PLATIVE ISP3023是一种耐酸蚀绝缘保护油墨，专门开发应用于电镀一般金属的阻镀保护作用，或者酸蚀加工抗蚀保护作用，如镀镍、镀铜、镀铬、镀锡等；

19. The effect of bismuth sulfate content in plating bath and current density on current efficiency, bismuth content and morphology of obtained tin-bismuth alloy was studied.: 研究了镀液中硫酸铋含量和电流密度对镀层铋含量、电流效率及镀层表面形貌的影响。

20. Pretreatment, silver plating, nickel plating and tin plating of chip components.: 应用于片式元器件的前处理、镀银、镀镍、镀锡等工艺。

21. A new technology of tin-nickel alloy electroplating from a pyrophosphating bath was studied. The effect of some plating parameters on the tin-nickel alloy coating was discussed.: 研究了从焦磷酸盐槽液中电镀锡镍合金的一种新工艺，讨论了一些电镀参数对锡镍合金镀层的影响。

22. Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced.: 介绍了晶纹镀锡中重熔工序的操作要点和安全要求。

23. The mechanism of electroless tin plating was discussed.: 对化学镀锡的机理做了探讨。

24. Five, tin gun black, tin cobalt nickel alloy plating gun black, cupronickel tin and chromium, cyanogens plating cupronickel tin environmental roll.: 锡镍枪黑色、锡钴合金镀枪黑色、白铜锡代铬、无氰环保滚挂镀白铜锡。

25. We have over 10 machines for steel ball manufacturing and filtering. And, one plating line is ready and it can plate nickel and tin.: 本公司有生产和分选导电钢珠珠的专业设备十几台，并且建有一条专门的电镀生产线，为本公司的产品电镀锡和镍。

26. Main products are as follows: a circuit board, gilded burnish, gold plated copper thick OSP protection (series), PCB plating copper brightener, PCB tin brightener, etc.: 主要产品如下：一、线路镀金光泽剂、线路板镀厚金工艺、线路板铜保护(osp)系列、线路板镀酸铜光亮剂、线路板镀锡光亮剂等。

27. Besides, deposition rate of electroless tin also increases with increasing plating time.: 若继续升高镀液温度，沉积速率却降低。

28. The effects of the composition and controlled conditions of electroless tin plating on the morphology of coatings are investigated.: 研究了化学镀锡溶液组成和工艺条件对镀层表面形貌的影响。

29. Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.: 介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。

30. Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.: 触点电镀：镀镍金的接触面积的锡焊尾电镀。

百度翻译

tin-plating的意思

有道翻译

tin-plating的翻译

相关单词