underfill
英[ˈʌndəfɪl]
美[ˈʌndərˌfɪl]
双语例句
- 1. In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
- 文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
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- 2. The first underfill is filled between the first chip and the second chip in order to wrap the first bump.
- 以及第一底胶，填充在所述第一芯片与所述第二芯片之间，且包覆所述第一凸块；
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- 3. Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
- 基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
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- 4. The die cracking with no-flow underfill is analyzed and compared with the case for conventional capillary-flow underfill.
- 用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题。
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- 5. Engineers can optimize via design using ANSYS tools, identifying and resolving the effects of coating and underfill materials.
- 工程师可以使用ANSYS工具优化设计、识别和解决涂层和填充材料的影响。
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- 6. Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.
- 通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。
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- 7. As the density for mobile electronic product becomes higher and higher and underfill technology improved, more and more underfill material have been developed.
- 随着移动电子产品的密度越来越高，底层填充技术逐步提高，越来越多的底层填充材料被研发。
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- 8. As the density for mobile electronic product becomes higher and higher and underfill technology improved, more and more underfill material have been developed.
- 随着移动电子产品的密度越来越高，底层填充技术逐步提高，越来越多的底层填充材料被研发。
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